Dicing at Innovative Fabrication
Precision optical alignment and sawing of all types of glass, ceramic, aluminum nitride, lithium niobate, sapphire, beryllium oxide, silicon, germanium, GaAs, and many other hard and brittle materials. X,Y, and Z indexing accuracy of +/- 2.5 microns. Theta angle repeatability of +/- 6 arc seconds.
- Beveling, scribing and trenching ability.
- Visual inspection from AQL to 100%.
- Manual sort and load into customer defined
chip tray or Gel-Pak. - Process development and R&D support.
- From prototype to production volumes.
DICING
Precision optical alignment and sawing of all types of glass, ceramic, aluminum nitride, lithium niobate, sapphire, beryllium oxide, silicon, germanium, GaAs, and many other hard and brittle materials.
CAPABILITIES
Precision optical alignment and sawing of all types of glass, ceramic, aluminum nitride, lithium niobate, sapphire, beryllium oxide, silicon, germanium, GaAs, and many other hard and brittle materials.
Equipment
Precision optical alignment and sawing of all types of glass, ceramic, aluminum nitride, lithium niobate, sapphire, beryllium oxide, silicon, germanium, GaAs, and many other hard and brittle materials.