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Precision optical alignment and sawing of all types of glass, ceramic, aluminum nitride, lithium niobate, sapphire, beryllium oxide, silicon, germanium, GaAs, and many other hard and brittle materials. X,Y, and Z indexing accuracy of +/- 2.5 microns. Theta angle repeatability of +/- 6 arc seconds. Beveling, scribing and trenching ability. Visual inspection from AQL to 100%. Manual sort and load into customer defined chip tray or Gel-Pak. Process development and R&D support. From prototype to production volumes. |
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